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Focusing on the field of semiconductor air purification, MayAir focuses on creating high-end cleanliness

Focusing on the field of semiconductor air purification, MayAir focuses on creating high-end cleanliness

  • Time of issue:2021-07-22

(Summary description)In the past 50 years, the technology node of integrated circuits has been drastically reduced from 10 micrometers (μm) in 1971 to the current 7 nanometers (nm), and it is even advancing to a smaller 3nm node. The critical dimensions of semiconductor wafers are becoming smaller and smaller, prompting increasingly stringent requirements for the cleanliness of the clean room production environment. Gaseous molecular pollutants (AMC) have gradually replaced particulate pollutants and become one of the key factors affecting industrial process yields.

Focusing on the field of semiconductor air purification, MayAir focuses on creating high-end cleanliness

(Summary description)In the past 50 years, the technology node of integrated circuits has been drastically reduced from 10 micrometers (μm) in 1971 to the current 7 nanometers (nm), and it is even advancing to a smaller 3nm node. The critical dimensions of semiconductor wafers are becoming smaller and smaller, prompting increasingly stringent requirements for the cleanliness of the clean room production environment. Gaseous molecular pollutants (AMC) have gradually replaced particulate pollutants and become one of the key factors affecting industrial process yields.

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  • Time of issue:2021-07-22 16:28
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In the past 50 years, the technology node of integrated circuits has been drastically reduced from 10 micrometers (μm) in 1971 to the current 7 nanometers (nm), and it is even advancing to a smaller 3nm node. The critical dimensions of semiconductor wafers are becoming smaller and smaller, prompting increasingly stringent requirements for the cleanliness of the clean room production environment. Gaseous molecular pollutants (AMC) have gradually replaced particulate pollutants and become one of the key factors affecting industrial process yields.

AMC may cause a large number of potential process problems: for example, acid gas (MA) is corrosive, which will erode the metal film on the wafer, causing pits, line open circuits, short circuits, leakage, etc.; alkaline gas (MB) ammonia gas Existence will affect the defects of the photolithography pattern and cause the top of the photoresist line to be T-topping; the condensable organic gas (MC) can easily adhere to the surface of the silicon wafer, forming a thin film and surface molecular contamination (SMC), the photoresist layer, sputtering layer, PVD layer or CVD layer will form a sandwich structure; in addition, volatile VOCs containing silicon, phosphorus, boron, etc., such as siloxane, organophosphate, etc. If it adheres firmly to the surface of silicon wafer, lithography machine lens or lithography plate, it will be difficult or impossible to remove.) If the organic phosphate is adsorbed on the surface of the silicon wafer, it will decompose into inorganic phosphide after being heated and become a dopant, causing undesirable n-type doping, leading to problems such as voltage drift.

The semiconductor production process includes sophisticated microelectronic systems and ICs. The requirements for the cleanliness of the production environment are particularly strict. Therefore, the entire manufacturing process is carried out under strictly controlled environmental conditions, which is a generally familiar clean room.

In order to maintain the cleanliness of the clean room, the semiconductor clean room usually uses a vertical unidirectional flow method to exhaust indoor polluted air to the outdoors through the push-out function, so as to achieve the purpose of purifying indoor air.

Clean room air purification is mainly segmented into three stages:

In the first stage, through the primary filter, primary secondary filter, HEPA filter, and chemical filter in the AHU, multi-stage filtering is performed on the outdoor air, and the debris, floating matter and particles above 0.3 µm in diameter are removed step by step. And chemical pollutants in the atmosphere;

In the second stage, through the fan filter unit and filtered by the built-in (or matched) HEPA, ULPA filter, and chemical filter (when required by the process), a stable laminar flow of clean air is pushed into the clean room. The air is purified and reaches a very high standard of cleanliness;

In the third stage, the return air of the clean room is sent to the fan filter unit through the raised floor and the air supply duct (or return air duct), filtered by the HEPA, ULPA filter, and chemical filter, and then sent to the clean room to repeat use.

The main structure diagram of MayAir semiconductor clean factory and the application process of main products are as follows:

The external air enters the internal circulation system of the clean room after being filtered step by step through multi-level air filters (No. 1 to 4). After that, the clean air is sent to the interior of the clean room in a stable laminar flow through the fan filter unit with HEPA/ULPA filters and optional chemical filters (No. 5, 6, 7), and the fan filter unit runs continuously maintain a stable cleanliness of the work area. In specific equipment or working areas with higher cleanliness requirements, the air is further purified inside the clean room through the purification shed with EFU (No. 8, 9) to achieve a higher level of cleanliness in the local area.

Since receiving the first Chengdu SMIC's own brand FFU order in 2005, MayAir has repeatedly assisted the development of China's semiconductor industry, occupying an important position in the professional field of high-end clean room.

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